The IPC/EIA/JEDEC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the pre-eminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products.  A quick explanation of the JSTD documents.

• Instructional skills and the roles and responsibilities of Certified IPC Trainers.
• General requirements, such as safety, tools and electrostatic discharge (ESD).
• Wire and terminal assembly requirements, demonstrations and laboratory.
• Through hole technology requirements, demonstrations and laboratory.
• Surface mount technology requirements, demonstrations and laboratory.
• General soldered connection acceptance requirements. NOW INCLUDED LEAD FREE
• Machine and reflow soldering process requirements.
• Test methods and related standards.
• Using statistical process control methodology.

WHO SHOULD BECOME AN
IPC J-STD-001 CERTIFIED IPC TRAINER?

Assembly process engineers, quality assurance supervisors, training managers and others responsible for the quality and reliability of soldered electronic assemblies are excellent candidates for the program.

Any company that uses J-STD-001 or is considering its adoption can use the program to address the training requirement identified in the standard.

While there are no formal entrance requirements, Certified IPC Trainer candidates must have excellent hand soldering skills and ideally in training as well.

JSTD Document overview.

 IPC/EIA/JEDEC J-STD-001 ANSI approved lead free acceptance criteria.  World recognized as the sole industry consensus standard covering soldering materials and processes, includes criteria for lead free manufacturing, materials, methods and verification for producing quality soldered interconnections and assemblies.

 IPC/EIA/JEDEC J-STD-002 Solderability tests for component leads terminations, lugs, terminals and wires.  Test method choices, defect definitions, acceptance criteria and illustrations for both the supplier and user

 IPC/EIA J-STD-003 Solderability for printed boards Industry recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes.  Test methods covered include edge dip, rotary dip, solder float, wave solder, and wetting balance

 IPC J-STD-004 Requirements for Soldering Fluxes. Covers requirements for qualification and classification of rosin, organic, and inorganic fluxes according to activity level and halide content of the fluxes.  Includes flux containing materials and low residue fluxes for no clean processes.

 IPC/EIA J-STD-005 Requirements for Soldering Pastes Covers requirements for qualification and characterization of solder paste.  Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder paste.

 IPC J-STD-006 Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications. Prescibes the nomenclature, requirements and test methods for electronic grade solder alloys, fluxed and non-fluxed bar, ribbon, and powder solder; electronic soldering applications and “special” electronic grade solders.This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process.