Upcoming sessions: FULL ONLINE SCHEDULE

May 8th, 2009 at 1:30 pm EST ESD Awareness $275.00/ student(multi student discounts available) ESD terms and definitions, ESD vs EOS, charge sources and potentials, acceptable workstation configurations, static dissipative materials, antistatic materials, and static sheilding materials, all training in accordance with Ansi 2020 and IPC standards.
To register go to https://circuittechnology.webex.com/meet/rblackard locate the session you want to attend and click register or join. Or download the registration form here.

May 15th, 2009 at 1:30pm EST Component Identification $275.00/student (discounts available) This course covers updated information on small shrink outline package, thin small outline package, quad flat pack, low-profile quad flat pack, plastic quad flat package, leadless chip carrier, quad flat no-lead, and ball grid array-related packages, including all the variations within those groups; new components include dual flat no-lead, quad flat no-lead multi-row, package on package, chip scale package, chip on board, bare die, and flip chip as well as your axial and radial leaded PTH components and color code understanding and reading.
To register go to https://circuittechnology.webex.com/meet/rblackard locate the session you want to attend and click register or join. Or download the registration form here.

June 2, at 130pm EST Introduction to IPC
This is a live session with IPC instructors at Circuit Technology. We discuss interactively what each certification covers and how it is presented to students. We then give you a better understanding of which classes you need and in what order the training should go. If you are trying to decide on IPC courses or have any questions about the certifications this is a must session for you.
To register go to https://circuittechnology.webex.com/meet/rblackard locate the session you want to attend and click register or join. Or download the registration form here.

June 4th, Intro to BGA Profiling Introductory Price $250.00/Student (multi student or company wide rates/discount available. This 2 hour interactive IPC Master Instructor led online class will cover BGA terminology, basics of soldering including intermettalic bonding, solder and flux chemistries and workmanship criteria for BGA solder joints. Time Temperature Profiling will be studied indept including preheating, soaking, time above liquidous and cooling. Inspection techniques and methodologies will be explored, including look under scope and Xray technologies.